INFLUENCE OF A FLUX OF HIGH-VELOCITY MICROPARTICLES ON THE PARAMETERS
OF INTEGRATED CIRCUITS PLACED BEHIND A THICK-WALLED OBSTACLE

A. I. Belous,a O. A. Dybov, b 
G. S. Romanov, c  T. V. Petlitskayaa  , and
G. I. Usova 

UDC 534.2

Experimental data showing that on collision of a flux 
of high-velocity microparticles (which is close to the fluxes of space 
particles in parameters) with a thick-walled metal obstacle we have 
failure of integrated circuits placed behind this obstacle have been 
given.

a "Belmikrosistemy" Unitary Enterprise, 
Minsk, Belarus; b Scientific-Research Institute 
of Pulsed Processes with Pilot Production, Minsk, Belarus; email: 
impuls@bn.by; c A. V. Luikov Heat and Mass 
Transfer Institute, National Academy of Sciences of Belarus, 15 P. 
Brovka Str., Minsk, 220072, Belarus. Translated from Inzhenerno-
Fizicheskii Zhurnal, Vol. 77, No. 4, pp. 89-91, July-August, 2004. 
Original article submitted November 10, 2003.