INFLUENCE OF TEMPERATURE-TIME PARAMETERS OF HEAT TREATMENT 
ON THE PROCESS OF PLANARIZATION OF THE SURFACE RELIEF
OF MICROELECTRON STRUCTURES 
S. P. Zhvavyi, G. D. Ivlev,
V. A. Pilipenko, and V. N. Ponomar'

UDC 621.3.049.77.002

The authors consider the process of fusion of phosphorosilicate 
and borophosphorosilicate glasses in planarization of the surface 
of integrated microcircuits under the conditions of both isothermal 
and pulse heat treatment. An expression for calculating the angle 
of fusion of the relief step as a function of the concentration of 
doping impurities in a glass and the time and temperature of heat 
treatment is obtained.

Institute of Electronics, National Academy of Sciences 
of Belarus, Minsk, Belarus. Translated from Inzhenerno-Fizicheskii 
Zhurnal, Vol. 74, No. 2, pp. 127-132, March-April, 2001. 
Original article submitted May 5, 2000.

JEPTER7492020014
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