FACTORS INFLUENCING THE CHARACTERISTICS OF WETTING OF PARTS OF A VAPOR CHAMBER

A study has been made of conditions for the electrochemical deposition of copper on copper plates and of the infl uence of the microroughness of their surface on the wetting of the plates. This permitted determining the optimum regimes of deposition of coatings on elements of vapor chambers with the aim of creating such elements with controlled wetting properties.
   
Author:  O. L. Voitik, K. I. Delendik, N. V. Kolyago, and L. Yu. Roshchin
Keywords:  microroughness, contact wetting angle, hydrophilic and hydrophobic coatings, wetting hysteresis, electrochemical deposition
Page:  1089