Volume 97, №7
SOLUTION TO THE PROBLEM OF THERMAL CONTACT BETWEEN THE WICK AND THE BODY OF A FLAT HEAT PIPE BY MEANS OF A BAROTHERMIC PROCESS
A fl at heat pipe with the dimensions of 150 × 30 × 3 mm with an improved thermal contact between the wick and the body has been developed and fabricated. The body was made using chemical etching of a copper billet; the heattransfer agent was water; the wick was made up of brass meshes soldered to the body by means of a barothermic process. An experimental sample of a fl at heat pipe has been investigated at various heat loads. The hydrodynamic boundary of the pipe is 106 ± 2 W; the optimum transmission capacity is 75.2 ± 1.1 W at the thermal resistance 0.044 ± 0.011 K/W. The paper shows the advantages of the developed technology of wick formation by means of a barothermic process due to a reduction in thermal resistance with increase in the transmitted power of the heat pipe.
A fl at heat pipe with the dimensions of 150 × 30 × 3 mm with an improved thermal contact between the wick and the body has been developed and fabricated. The body was made using chemical etching of a copper billet; the heattransfer agent was water; the wick was made up of brass meshes soldered to the body by means of a barothermic process. An experimental sample of a fl at heat pipe has been investigated at various heat loads. The hydrodynamic boundary of the pipe is 106 ± 2 W; the optimum transmission capacity is 75.2 ± 1.1 W at the thermal resistance 0.044 ± 0.011 K/W. The paper shows the advantages of the developed technology of wick formation by means of a barothermic process due to a reduction in thermal resistance with increase in the transmitted power of the heat pipe.
Author: O. L. Voitik, K. I. Delendik, N. V. Kolyago
Keywords: fl at heat pipe, wick, thermal resistance, porosity, permeability, barothermic process
Page: 1680
O. L. Voitik, K. I. Delendik, N. V. Kolyago .
SOLUTION TO THE PROBLEM OF THERMAL CONTACT BETWEEN THE WICK AND THE BODY OF A FLAT HEAT PIPE BY MEANS OF A BAROTHERMIC PROCESS //Journal of engineering physics and thermophysics.
. Volume 97, №7. P. 1680.
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