LOOP THERMOSYPHON FOR COOLING HEAT-LOADED ELECTRONICS COMPONENTS

The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fl uxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1^o C/W.
The thermal properties of a loop thermosyphon made of copper with a horizontally located evaporator, covered by a porous coating, and a condenser intended for cooling powerful electronic devices and transferring heat fl uxes with a power of 1 kW and above have been studied. The characteristics of thermosyphon evaporators having capillary structures and liquid- and air-cooled condensers of various types were studied experimentally. It is shown that coating the capillary grooves by a thin layer of sintered powder makes it possible to more than halve the thermal resistance of the thermosyphon evaporator and that, with a condenser cooled by air, the total thermal resistance of the device does not exceed 0.1^o C/W.
Author:  L. L. Vasiliev, A. S. Zhuravlyov, M. A. Kuz'mich, V. K. Kulikovskii, V. A. Olekhnovich
Keywords:  heat pipe, thermosyphon, heat exchange, cooling, phase transition, porous wick
Page:  1708