THERMOPHYSICAL PROPERTIES AND TEMPERATURE OF THE START OF TITANIUM RECRYSTALLIZATION IN DIFFERENT STRUCTURAL STATES

The results of measurements of the thermal diffusivity, thermal conductivity, and heat capacity of VT1-0-grade titanium samples in as-cast, deformed submicrocrystalline, and sintered states are presented. It has been established that the decrease in the thermal conductivity and thermal diffusivity of titanium in the submicrocrystalline and sintered states is associated with the increase in the quantity of defects in the material volume, whereas the increase in the temperature of polymorphic transformation of titanium is connected with the dissolution of oxygen in its lattice. The results of investigation of the coefficient of thermal linear expansion of titanium in the macrocrystalline and submicrocrystalline states are presented. The decrease in the coefficient of thermal linear expansion of titanium of submicrocrystalline structure has been established, which may point to the decrease in its melting temperature. It is shown that annealing of samples in a submicrocrystalline state leads to the growth of the temperature coefficient of linear expansion, bringing its value closer to the temperature coeffi cient of linear expansion of titanium in the equilibrium state. Studies by the method of back reflection photography in a KROS chamber made it possible to estimate the temperature of the start of VT1-0-grade titanium recrystallization after intense plastic deformation by the twist extrusion method. The decrease in the temperature of the start of recrystallization for titanium in the deformed submicrocrystalline state has been established. Based on the trends revealed, optimum regimes of thermal treatment of VT1-0-grade titanium for removing internal stresses and preserving the submicrocrystalline structure have been established.
   
Author:  D. V. Pavlenko, D. V. Tkach, S. M. Danilova-Tret′yak, and L. E. Evseeva
Keywords:  titanium, twist extrusion, structural state, thermophysical properties, thermal conductivity, thermal coeffi cient of linear expansion, recrystallization temperature
Page:  685